The main products include KOKI welding materials, Zymet glue, cleaning agent, TIM materials.
Types | Model | Tg by TMA,oC | CTE,ppm/oC | Viscosity/cps | Reworkable | Characteristic |
Underfill | CN-1738 | 90 | 60 | 300 | YES | Suitable for CSP and BGA packaging, fast curing at low temperature, good fluidity, the adhesive has excellent adhesion to organic substrates. |
CN-1780-5 | 119 | 32 | 3800 | YES | Suitable for BGA, WL-CSP packages, fast flow to improve shock and vibration performance, and thermal cycle performance. Its maximum particle size is 10 microns and can fill gaps of 0.5 microns. The adhesive has excellent adhesion to organic substrates. | |
X2852C | 65 | 25 | 6000 | NO | An underfill encapsulant suitable for wafer-level packaging and BGA packaging. It can be cured quickly at low temperature and has fast fluidity. This encapsulant has excellent adhesion to organic substrates. | |
Edgebond adhesive | UA-2605-B | 134 | 30 | 220,000 | YES | Suitable for BGA, CSP, and other surface mount components, this glue can improve the thermal cycle performance of CBGAs and BGAs, and its heat-resistant cycle (0°C ~ +100°C) performance has been tripled to 2,500 cycles, low temperature fast solidified. |
Address：Room 804, No. 200. Xinghai Rd, Suzhou City, Jiangsu Province, China
Phone：0512-62567570
0512-62567686
Email：solder@dingshengsz.com
